3-dimensional soldering process for a MID (molded interconnect device) application
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3-dimensional soldering process for a MID (molded interconnect device) application

After having described the influence of aperture variations and vacuum on the number of voids and void content in BTCs (bottom terminated components) in part 1 and part 2, a further advantage of the targeted use of vacuum is shown in part 3. As a result of the uniform distribution of the vapor during the…

What are the benefits of soldering with vacuum profiles?
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What are the benefits of soldering with vacuum profiles?

Now that the issue of soldering with vacuum profiles has been introduced in part 1, we’ll take a closer look at the process and discuss the obtained soldering results in part 2. Figure 1 shows the overall layout of the test board, although only the components with ground connection will be considered for this evaluation….

Qu’offre le brasage avec des profils de vide ? – Partie 2
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Qu’offre le brasage avec des profils de vide ? – Partie 2

La première partie a permis une première approche du sujet du brasage avec des profils de vide. La deuxième partie vient approfondir le sujet et discute des résultats de brasage obtenus. L’illustration 1 montre la structure globale de la planche d’essai, mais cette évaluation ne prend en compte que les composants disposant de raccords de…

Globally Networked – Controlled as if by Magic? – Industry 4.0
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Globally Networked – Controlled as if by Magic? – Industry 4.0

More and More Public Focus on Industry 4.0 Initiatives During the age of computer-controlled production sequences, abbreviations like CAM, CAD and CNC are a common part of manufacturing reality. When the term Industry 4.0 made its first public appearance at the 2011 Hanover Trade Fair, the associated content was new to only a certain extent….

Nota de Prensa – La soldadura con perfiles de vacío
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Nota de Prensa – La soldadura con perfiles de vacío

¿Qué ofrece la soldadura con perfiles de vacío? En el ámbito de la fabricación de componentes electrónicos, la demanda por unos puntos de soldadura sin huecos es cada vez mayor, es decir, una reducción o eliminación de espacios vacíos en la técnica de unión entre las conexiones de los componentes y las placas de contacto….

Press Release – The benefits of soldering with vacuum profiles
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Press Release – The benefits of soldering with vacuum profiles

What are the benefits of soldering with vacuum profiles? Requirements for void-free solder joints are continuously increasing in the field of electronics manufacturing, i.e. the reduction or elimination of cavities in the connection technology used between component connectors and connector pads. New challenges evolve on a daily basis due to the relentless introduction of new…

Média – Brasage avec des profils de vide
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Média – Brasage avec des profils de vide

Qu’offre le brasage avec des profils de vide ? Dans le domaine de la fabrication électronique, les exigences concernant l’absence de Voids, c’est-à-dire une diminution ou élimination de cavités créées entre les connexions des composants et les plots de connexion, augmentent sans cesse dans la connectique. Les variantes constamment nouvelles des Bottom Terminated Components (BTC) constituent…

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